Method of connecting circuit boards
AssigneeDenso Corporation
InventorsToshihiro Miyake, Koichi Shigematsu, Kazuya Sanada, Hideharu Ishihara, Yoshitaro Yazaki
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Abstract
The present invention provides a circuit board connecting method that includes an alkane application step and a heat-press-bonding step. The alkane application step is a preliminary step which applies an alkane group to a printed circuit board. The heat-press-bonding step heat-press-bonds a flexible circuit board to the printed circuit board by positioning their printed wire terminals and conductive thick-film terminals to face one another.
Claims5
A method of connecting a first wiring connector on a first circuit board and a second wiring connector on a second circuit board, comprising:
- disposing said first wiring connector on said first circuit board and said second wiring connector on said second circuit board, said first wiring connector disposed opposite said second wiring connector, said first wiring connector on said first circuit board composed of metal and said second wiring connector on said second circuit board composed of metal and having a hydrocarbon compound interposed therebetween, said hydrocarbon having a C—H bond disassociation energy less than 950 kJ/mol;
- and
- decomposing said hydrocarbon compound to form a radical, said hydrocarbon compound being decomposed by separating hydrogen from said hydrocarbon compound by heating said hydrocarbon compound and reducing oxide film on a surface of said metal of said first wiring connector and said second wiring connector with said radical formed from said hydrocarbon compound so that said first wiring connector on said first circuit board and said second wiring connector on said second circuit board are bonded by fusion or diffusion,
- wherein said hydrocarbon compound is at least a member selected from the group consisting of cyclooctane, tetramethylpentadecane, triphenylmethane, dicyclopentadiene, and dihydroanthracene.
Dependencies are inferred from the claim text.