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US 6,598,779 B2Granted
Electronic component mounting method
AssigneeMurata Manufacturing Co., Ltd.
InventorsRyoichi Morimoto, Jitsuho Hirota
Life of this patent
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AssigneeMurata Manufacturing Co., Ltd.
InventorsRyoichi Morimoto, Jitsuho Hirota
Estimating the term…
An electronic component mounting method by which a surface-mount component and an IC can be efficiently and reliably mounted on a single substrate is provided. A high-temperature solder paste (4) is supplied to electrodes (2) for receiving surface-mount components (40), and the surface-mount components (40) are provisionally fixed on the electrodes (2) with the high-temperature solder paste (4). In addition, flux (5) is applied to an electrode (1) for receiving an IC (30a) that is provided with eutectic solder bumps (31) or on the eutectic solder bumps (31), and the IC (30a) is provisionally fixed on the electrode (1) with the flux (5). Then, a wiring substrate (10) is heated to a high temperature at which both the high-temperature solder and the eutectic solder melt, so that the surface-mount components (40) and the IC (30a) are reflow-soldered.
An electronic component mounting method for manufacturing a surface-mounted unit in which a surface-mount component and an IC are disposed on a single wiring substrate, the electronic component mounting method comprising the steps of:
An electronic component mounting method for manufacturing a surface-mounted unit in which a surface-mount component and an IC are disposed on a single wiring substrate provided with an electrode for receiving the surface-mount component, an electrode for receiving the IC, and eutectic solder bumps formed on the electrode for receiving the IC, the electronic component mounting method comprising the steps of:
Dependencies are inferred from the claim text.