Temperature control unit for dies or molds, particularly for pressure die-casting or injection-molding aluminum and alloys thereof, plastic materials and the like

A temperature control unit for dies and molds, comprising a die or mold cooling circuit through which pressurized water flows, a water feed pump being connected to said circuit adapted to feed water into said circuit and being adjustable to a pressure which is higher than the evaporation pressure of water at a preheating temperature of said water, which can be detected by a first sensor for detecting the temperature of said water, said circuit including a circulation pump adapted to circulate water in said circuit, a water overflow valve which can be set to a lower pressure than said feed pump, and a heating unit which is controlled by said first temperature sensor, a die or mold temperature sensor being further provided which controls said feed pump by feeding water, at a temperature lower than the temperature of the water circulating in the circuit, into said circuit to mix with water circulating in said circuit, said water overflow valve continuously discharging the water fed by the water feed pump and mixed with the water circulating in the circuit, when the temperature of the die has to be lowered.