Method of manufacturing a circuit board using a porous sheet composed of cellulose
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsShigetoshi Segawa, Yasuyuki Baba, Katsuyoshi Ishikawa, Kazuhiko Ihara
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Abstract
A manufacturing method of a circuit board comprises the steps of: (a) feeding a printing stage having a porous member comprising a porous plate and a porous sheet, the porous sheet is composed of 90 wt % to 98 wt % of cellulose; (b) placing a plate for the circuit board having a pierced hole above the porous member; and (c) filling a conductive material in the pierced hole from an upper side of the plate for circuit board by sucking the porous member at a prescribed vacuum pressure from a back of the porous member.
Claims10
A manufacturing method of a circuit board comprising the steps of:
- (a) feeding a printing stage having a porous member comprising a porous plate and a porous sheet, said porous sheet is composed of 90 wt % to 98 wt % of cellulose;
- (b) placing a plate for the circuit board having a pierced hole above said porous member;
- and
- (c) filling a conductive material in said pierced hole from an upper side of said plate for said circuit board by sucking said porous member at a prescribed vacuum pressure from a back of said porous member.
Dependencies are inferred from the claim text.