Die clamping apparatus, die clamping force measurement method and die clamping force adjustment method

A die clamping apparatus comprising

• a fixed die plate fixed on a base and holding a fixed die,
• a movable die plate for holding a movable die facing said fixed die and movable on said base,
• a link housing connected with said fixed die plate by tie bars while interposing said movable die plate therebetween and movable on said base,
• a toggle mechanism for generating a die clamping force between said movable die plate and said fixed die plate through said tie bars by moving apart said movable die plate and said link housing,
• a position adjusting means provided between said link housing and said tie bars and connecting the link housing and the tie bars so as to enable the position adjustment of the link housing to said tie bars,
• a link housing position detecting means for detecting a first position of said link housing on said base in a state where said movable die moves from a predetermined die open position to a die closing direction and a die clamping force has not been generated and a second position of said link housing on said base in a state where the clamping is completed, and
• a die clamping force calculating means for calculating the die clamping force based on a difference of said first and second positions detected by said link housing position detecting means.