UV laser system and method for single pulse severing of IC fuses

A method for aligning a laser processing beam to a link of an IC device, comprising:

• generating green laser light for propagation along a first optical path;
• splitting the green laser light into a major portion and a lesser portion such that the major portion of the green laser light propagates along the first optical path and such that the lesser portion propagates along a second optical path;
• employing a nonlinear crystal positioned along the first optical path to convert green laser light traveling along the first optical path to UV laser light;
• causing beam modulation to impart a high attenuation state to the UV laser light to provide low power UV laser output;
• directing low power UV laser output along the first optical path and through a beam combiner toward a target;
• detecting UV light reflected from the target;
• causing beam modulation to impart a full attenuation state to the UV laser light to block the transmission of UV laser light toward the target;
• directing the lesser portion of the green laser light along the second optical path and through the beam combiner of the first optical path toward the target;
• detecting green light reflected from the target;
• and
• calibrating relative positions of the low power UV laser output and the lesser portion of grew laser light.

A method for aligning a laser processing beam to a link of an IC device, comprising:

• generating first harmonic IR laser light and second harmonic green laser light for propagation thong a first optical path;
• splitting the green laser light into a major portion and a lesser portion such that the major portion of the green laser light propagates along the first optical path and such that the lesser portion propagates along a second optical path;
• employing a nonlinear crystal positioned along the first optical path to convert green laser light and IR laser light traveling along the first optical path to third harmonic UV laser light;
• causing beam modulation to impart a high attenuation state to the UV laser light to provide low power UV laser output;
• directing low power UV laser output along the first optical path and through a beam combiner toward a target;
• detecting UV light reflected from the target;
• causing beam modulation to impart a full attenuation state to the UV laser light to block the transmission of UV laser tight toward the target;
• directing the lesser portion of the green laser light along the second optical path and through the beam combiner of the first optical path toward the target;
• detecting green light reflected from the target;
• and
• calibrating relative positions of the low power UV laser output and the lesser portion of the green laser light.

A method for aligning a laser processing beam to a link of an IC device, comprising:

• generating first harmonic IR laser light and second harmonic green laser light for propagation along a first optical path;
• splitting the IR laser light into a major portion and a lesser portion such that the major portion of the IR laser light it propagates along the first optical path and such that the lesser portion propagates along a second optical path;
• employing a nonlinear crystal positioned along the first optical path to convert green laser light and IR laser light traveling along the first optical path to third harmonic UV laser light;
• causing beam modulation to impart a high attenuation state to the UV laser light to provide low power UV laser output;
• directing low power UV laser output along the first optical path and through a beam combiner toward a target;
• detecting UV light reflected from the target;
• causing beam modulation to impart a full attenuation state to the UV laser light to block the transmission of UV laser light toward the target;
• directing the lesser portion of the IR laser light along the second optical path and through the beam combiner of the first optical path toward the target;
• detecting IR light reflected from the target;
• and
• calibrating relative positions of the low power UV laser output and the lesser portion of the IR laser light.

A method for aligning a laser processing beam to a link of an IC device, comprising:

• generating first harmonic IR laser light and second harmonic green laser light for propagation along a first optical path;
• employing a nonlinear crystal positioned along the first optical path to convert green laser light traveling along the first optical path to fourth harmonic UV laser light;
• causing beam modulation to impart a high attenuation state to the UV laser light to provide low power UV laser output;
• directing low power UV laser output along the first optical path and through a beam combiner toward a target;
• detecting UV light reflected from the target;
• causing beam modulation to impart a full attenuation state to the UV laser light to block the transmission of UV laser light toward the target;
• directing the lesser portion of the IR laser light along a second optical path and through the beam combiner of the first optical path toward the target;
• detecting IR light reflected from the target;
• and
• calibrating relative positions of the low power UV laser output and the lesser portion of the IR laser light.