Waferized power connector
AssigneeTeradyne, Inc.
InventorsThomas S. Cohen, Allan L Astbury, Jr., Steven J. Allen
Life of this patent
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Abstract
An interconnect system for printed circuit boards. The interconnect system includes signal wafers that carry high speed signals between printed circuit boards. The interconnect system also includes power modules assembled from wafers. The power modules are compact, easy to manufacture and easily integrate with the signal contact wafers to provide a single connector.
Claims20
A power connector having an intermateable first connector piece and second connector piece, the first connector piece comprising:
- a) an insulative housing having a central cavity;
- b) a plurality of blades at the periphery of the central cavity;
- and the second connector piece comprising:
- a) a first wafer having power contacts running therethrough, the first wafer having a front edge and the power contacts of the first wafer having mating portions extending from the front edge of the first wafer;
- b) a second wafer attached to the first wafer, the second wafer having power contacts running therethrough, the second wafer having a front edge and the power contacts of the second wafer having mating portions extending from the front edge of the second wafer;
- c) a cap attached to the first wafer and the second wafer having an insulative wall disposed between the mating portions of the power contacts of the first wafer and the second wafer;
- wherein the power contacts of the first wafer and the second wafer in the second connector piece are aligned with the blades in the first connector piece when the first and second connector pieces are mated.
A power connector having an intermateable first connector piece and second connector piece, the first connector piece comprising:
- a) an insulative housing having a cavity;
- b) a plurality of blades at the periphery of the cavity;
- and the second connector piece comprising:
- a) a power subassembly made from a plurality of wafers, the wafers each having a major surface with the major surfaces of the wafers aligned in parallel with each other, each of the wafers further comprising a plurality of electrically separable power contacts, the power contacts of the wafers having mating portions positioned to enter the cavity of the insulative housing of the first connector piece when the first and second connector pieces are mated and to engage the blades of the first connector piece;
- b) a plurality of signal wafers, each signal wafer having a major surface with the major surfaces of the signal wafers being aligned in parallel with the major surfaces of the power wafers.
A power connector having an intermateable first connector piece and second connector piece, the first connector piece comprising:
- a) a first insulative housing having opposing inward facing walls;
- b) a plurality of power contacts disposed in the insulative housing alone the inward facing walls;
- a second connector piece comprising:
- a) a second insulative housing having a mating portion adapted to fit between the inward facing walls of the first insulative housing of the first connector piece, the second insulative housing having a first and a second outwdardly directed sides parallel with the inward facing walls of the first insulative housing of the first connector piece;
- b) a first plurality of electrically separable power contact elements within the second insulative housing bent in a right angle in a first plane and having exposed contact portions exposed on the first outwardly directed side;
- c) a second plurality of electrically separable power contact elements within the second insulative housing bent in a right angle in a second plane and having exposed contact portions exposed on the second outwardly directed side.
Dependencies are inferred from the claim text.