US 6,590,634 B1Granted

Exposure apparatus and method

AssigneeNikon Corporation

InventorsKenji Nishi, Kazuya Ota

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Abstract

Two stages (WS1, WS2) holding wafers can independently move between a positional information measuring section (PIS) under an alignment system (24a) and an exposing section (EPS) under a projection optical system (PI). The wafer exchange and alignment are performed on the stage (WS1), during which wafer (W2) is exposed on the stage (WS2). A position of each shot area of wafer (WS1) is obtained as a relative position with respect to a reference mark formed on the stage WS1 in the section (PIS). Relative positional information can be used for the alignment with respect to an exposure pattern when the wafer (WS1) is moved to the section (EPS) to be exposed. Therefore, it is not necessary that a stage position is observed continuously in moving the stage. Exposure operations are performed in parallel by the two wafer stages (WS1) and (WS2) so as to improve the throughput.

Claims50

Dependent claims

An exposure apparatus for forming a predetermined pattern on a sensitive substrate, wherein the exposure apparatus comprises:

a first holding member which holds a sensitive substrate;
a second holding member which holds a sensitive substrate;
a first movable member which is used commonly for the first and second holding members, and which is movable in a two-dimensional plane while supporting one of the first and second holding members in order for an exposure to be performed of the sensitive substrate held by the one holding member;
and
a second movable member which is used commonly for the first and second holding members, and which is movable in a two-dimensional plane while supporting the other of the first and second holding members in order for a measurement to be performed of the sensitive substrate held by the holding member;
a first interferometer system which obtains positional information of the one holding member held by the first movable member;
and
a second interferometer system which obtains positional information of the other holding member held by the second movable member;
each of the first and second holding members having a reflective surface used for the first and second interferometer systems;
and
the first and second movable members alternately support the first and second holding members.

8 more elements

An exposure method for forming a predetermined pattern on sensitive substrate, the method comprising:

exposing a sensitive substrate which is held on a first holding member, while moving a first movable member which supports said first holding member;
monitoring positional information of the first holding member which is supported by the first movable member by using a first interferometer system;
measuring alignment information of a sensitive substrate which is held on a second holding member, while moving a second movable member which supports said second holding member;
monitoring positional information of the second holding member which is supported by the second movable member by using a second interferometer system;
exchanging the holding members so that the first holding member is supported by the second movable member and the second holding member is supported by the first movable member;
exposing, after the exchange, the sensitive substrate held on the second holding member, while moving said first movable member which supports the second holding member;
and
monitoring, after the exchange, positional information of the second holding member which is supported by the first movable member by using said first interferometer system, each of the first and second holding members having a reflective surface used for the first and second interferometer systems.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 09/716,405Filed 21 Nov 2000 · division
Priority: JP 8-33284328 Nov 1996
Granted: 8 Jul 2003
Term ends: Not estimatedThe source records don’t support an estimate.

Classification11 codes

G03F 7/70216
Microphotolithographic exposure; Apparatus therefor: mask projection systems
G03F 7/70358
Mask projection systems: scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
G03F 7/70425
Microphotolithographic exposure; Apparatus therefor: imaging strategies, e.g. for increasing throughput or resolution, printing product fields…
G03F 7/70716
Handling of masks or workpieces: stages

Family

Application60/059,989Us provisional application · filed 25 Sep 1997
Application60/059,992Us provisional application · filed 25 Sep 1997
Application60/060,022Us provisional application · filed 25 Sep 1997
Application60/060,076Us provisional application · filed 25 Sep 1997
Application60/060,677Us provisional application · filed 25 Sep 1997
Application08/980,315Parent of this continuation · filed 28 Nov 1997
Application09/666,407Parent of this division · filed 20 Sep 2000
Application09/666,407Parent of this continuation
US 6,400,441 B1Related patent
US 6,590,634 B1This patent

From the US filing history. Foreign family members aren’t listed.