Method of reducing data communication time
AssigneeMicron Technology, Inc.
InventorStephen L. Casper
Life of this patent
Estimating the term…
Abstract
A memory device is described which is fabricated as an integrated circuit and uses distributed bond pads for electrical connection to an external conductive lead. The distributed bond pads are attached to a external lead, thereby eliminating bus lines on the integrated circuit memory. Distributed buffer circuits are described which can be included with the distributed bond pads to increase data communication time between the memory device and an external processor.
Claims26
A method of operating an integrated circuit comprising:
- receiving a data input on a single data input pin;
- receiving the data input signal on two data bond pads which are electrically coupled to the single data input pin;
- processing the data input signal using internal circuitry in response to the two data bond pads;
- generating a plurality of output signals;
- and
- coupling the plurality of output signals to a single data output pin via at least two data bond pads electrically connected to the single data output pin.
A method of operating an integrated circuit comprising:
- receiving a data input signal on a single input pin;
- distributing the data input signal to a plurality of distributed bond pads electrically connected to the single input pin;
- processing the data input signal using internal circuitry which is coupled to the plurality of distributed bond pads;
- generating at least one output signal;
- and
- coupling the at least one output signal to a single output pin via the plurality of distributed bond pads.
A method of operating an integrated circuit comprising:
- receiving a data input signal on a single input pin;
- distributing the data input signal to a plurality of distributed bond pads electrically connected to the single input pin;
- and
- processing the data input signal using internal circuitry which is coupled to the plurality of distributed bond pads.
A method of operating an integrated circuit comprising:
- generating a plurality of output signals;
- providing each of the output signals to separate data bond pads of a plurality of distributed data bond pads;
- and
- coupling at least two of the plurality of output signals to a single data output pin via at least two data bond pads of the plurality of distributed data bond pads, wherein the at least two data bond pads are electrically connected to the single data output pin.
A method of operating an integrated circuit comprising:
- receiving a data input signal on a single lead frame for distribution to sub-arrays of a memory cell array;
- distributing the data input signal to two bond pads of a plurality of distributed bond pads through bonded connections to the single lead frame, each of the two bond pads adjacent a different sub-array;
- and
- processing the data input signal at each bond pad using internal circuitry at each bond pad.
A method of operating an integrated circuit comprising:
- accessing a first memory cell in a first sub-array of an array of memory cells;
- processing data from the first memory cell through a first output buffer circuit at a first bond pad adjacent the first sub-array;
- coupling the data from the first bond pad bonded to a lead frame for output to an external processor;
- accessing a second memory cell in a second sub-array of the array of memory cells;
- processing data from the second memory cell through a second output buffer circuit at a second bond pad adjacent the second sub-array;
- and
- coupling the data from the second bond pad bonded to the lead frame for output to the external processor.
A method of operating an integrated circuit comprising:
- receiving data signals at a plurality of input pins, each input pin bonded to a separate extended lead frame traversing at least a portion of a semiconductor die on which a memory is formed, each extended lead frame bonded to a number of distributed bond pads, each bond pad adjacent a separate sub-array of memory cells of the memory;
- providing the received data signals directly to the distributed bond pads from the plurality of input pins;
- processing the received data signals at each distributed bond pad using internal circuitry coupled at each distributed bond pad;
- and
- storing data in the memory representative of the received data signals.
A method of operating an integrated circuit comprising:
- communicating data bi-directionally with the integrated circuit;
- and
- processing data through buffered input/output circuits coupling sub-arrays of memory cells within the integrated circuit to a plurality of data communication bond pads distributed adjacent each sub-array, wherein a data communication bond pad adjacent each sub-array is bonded to a common lead frame.
Dependencies are inferred from the claim text.