Liquid overclad-encapsulated optical device
AssigneeCorning Incorporated
InventorsAlain M. J. Beguin, Christophe F. P. Renvaze
Life of this patent
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Abstract
An optical device includes a planar substrate (10) on top of which is deposited a layer of waveguide material (402). A waveguide circuit (404) is etched into the waveguide material (402). A cover (426) selectively encapsulates the substrate (10) around the waveguide circuit (404) while leaving space to provide a gap above the waveguide circuit (404). A liquid material (30) having a lower index of refraction than the waveguide material is filled into the gap above the waveguide circuit (404) such that the liquid acts as an overclad for the waveguide circuit (404).
Claims17
An optical device comprising:
- an optical path characterized by a refractive index, for propagating a light signal;
- an optical modifying element disposed in the optical path for modifying the light signal;
- and
- an overclad liquid having a refractive index less than the refractive index of the optical path disposed between the optical path and the optical modifying element for reducing optical loss of the light signal wherein said liquid fills trenches disposed on at least one crosspoint and having variable actuation distances.
An optical device comprising:
- a planar substrate;
- a layer of waveguide material deposited on the planar substrate, the layer of waveguide material having a waveguide circuit etched into the waveguide material;
- a cover for selectively encapsulating the substrate around the waveguide circuit while leaving space to provide a gap above the waveguide circuit;
- and
- a liquid material having a lower index of refraction than the waveguide material filled into the gap above the waveguide circuit such that the liquid acts as an overclad for the waveguide circuit.
A method for fabricating a planar optical device, the method comprising the following steps:
- providing a planar substrate;
- depositing a layer of waveguide material onto the planar substrate;
- etching a waveguide circuit into the waveguide material;
- encapsulating the substrate around the waveguide circuit to provide a gap above the waveguide circuit, wherein said encapsulating step further comprises the following steps:
- depositing a solid overclad material layer on the waveguide material;
- forming an opposed pair of overclad sidewalls at opposed edges of the planar substrate by removing the solid overclad layer from the waveguide material away from the opposed edges of the planar substrate;
- mounting a cover on top of the opposed pair of overclad sidewalls for covering the planar substrate;
- and
- filling the gap above the waveguide circuit with a liquid material having a lower index of refraction than the waveguide material such that the liquid acts as an overclad for the waveguide circuit.
A method for fabricating a planar optical device, the method comprising the following steps:
- providing a planar substrate;
- depositing a layer of waveguide material onto the planar substrate;
- etching a waveguide circuit into the waveguide material;
- encapsulating the substrate around the waveguide circuit to provide a gap above the waveguide circuit;
- filling the gap above the waveguide circuit with a liquid material having a lower index of refraction than the waveguide material such that the liquid acts as an overclad for the waveguide circuit;
- and
- inserting an optical modifying element disposed in the waveguide circuit for modifying a light signal wherein the inserting step comprises inserting a MEMS mirror of a MEMS substrate in the waveguide circuit for modifying the light signal.
Dependencies are inferred from the claim text.