Stencil printing process optimization for circuit pack assembly using neural network modeling
AssigneeAvaya Technology Corp.
InventorKhalil N. Nikmanesh
Life of this patent
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Abstract
A system for determining the optimal settings for parameter of a stencil printing machine. The system generates a model mapping parameter inputs to output results. The model is then used to determine the optimal settings of parameter inputs in order to produce the desired results. One form of mapping is to generate a neural network model of a system. The neural network is generated from data that includes multiple sets of input parameter settings and the resulting output associated with the inputs. Back propagation is then performed on the neural network to determine the optimal settings.
Claims10
A method for determining optimal settings for a plurality of parameters that are used to regulate the operation of a stencil printing machine which applies a lead of solder paste to conductive paths located on a printed circuit board to enable the connection of circuit elements to said conductive paths, said method comprising the steps of:
- receiving input data representing said plurality of parameters and measurements of characteristics of said solder paste applied by said stencil printing machine, including:
- measuring a thickness of each said lead of said solder paste,
- measuring a width of each said lead of solder paste;
- generating, in response to receipt of said input data, a neural network model that serves to map said plurality of parameters to said measured characteristics of said solder paste applied by said stencil printing machine, including increasing an accuracy of said width of each said lead of solder paste as a spacing between adjacent conductive paths located on a printed circuit board decreases;
- determining, in response to generation of said model, a set of optimal settings for said plurality of parameters from said model;
- and
- outputting said set of optimal settings to regulate the operation of said stencil printing machine.
A system for determining optimal settings for a plurality of parameters that are used to regulate the operation of a stencil printing machine which applies a lead of solder paste to conductive paths located on a printed circuit board to enable the connection of circuit elements to said conductive paths, comprising:
- means for receiving input data representing said plurality of parameters and measurements of characteristics of said solder paste applied by said stencil printing machine, including:
- means for measuring a thickness of each said lead of said solder paste,
- means for measuring a width of each said lead of solder paste;
- means, responsive to receipt of said input data, for generating a neural network model that serves to map said plurality of parameters to said measured characteristics of said solder paste applied by said stencil printing machine, including increasing an accuracy of said width of each said lead of solder paste as a spacing between adjacent conductive paths located on a printed circuit board decreases;
- means, responsive to generation of said model, for determining a set of optimal settings for said plurality of parameters from said model;
- and
- means for outputting said set of optimal settings to regulate the operation of said stencil printing machine.
Dependencies are inferred from the claim text.