Semiconductor laser
AssigneeRohm Co., Ltd.
InventorTakeshi Yamamoto
Life of this patent
Estimating the term…
Abstract
A support section is provided on one side of a stem, which is secured such that at least two leads are projected from both sides. A heat sink section is formed on the upper portion of the support section in a wide width extending to the side of the projecting two leads. A laser chip is mounted on the heat sink section. As a consequence, in the event of a laser chip having a large chip size and a large calorific value, the heat sink section is large-sized to improve heat dissipation characteristics, thereby obtaining a semiconductor laser having a small outside diameter and a thin type optical pickup.
Claims9
A semiconductor laser comprising:
- a stem in which at least two leads penetrate through-holes of a base and are secured to said base with an insulated material so that said at least two leads are projected from both sides of said base;
- a support section provided on one side of said stem;
- a heat sink section formed on the upper portion of said support section, said heat sink section having a wide width portion extending to the side of said at least two leads which is wider in a width than said support section;
- and
- a laser chip secured to said heat sink section.
A semiconductor laser comprising:
- a stem in which at least two leads are secured to a cylindrical ring with an insulated material so that said at least two leads are projected from both sides of said cylindrical ring;
- a support section provided on one side of said stem;
- a heat sink section formed on the upper portion of said support section, said heat sink section having a wide width portion extending to the side of said at least two leads which is wider in a width than said support section;
- and
- a laser chip secured to said heat sink section.
Dependencies are inferred from the claim text.