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US 6,587,351 B2Granted
Surface mount standoff for printed circuit board assembly
AssigneeCooper Technologies Company
InventorsJeffrey Lynn Hollinsworth, Randy John Bicknese, Varinder Kumar Kalra, Keith Allen Spalding
Life of this patent
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Abstract
A standoff for a printed circuit board assembly is described. The standoff comprises at least one surface configured for surface mounting to a printed circuit board.
Claims5
A standoff for a printed circuit board including at least a first conductive trace pad and a second conductive trace pad for establishing a circuit to determine the presence of a number of standoffs, said standoff comprising:
- at least one surface having a dimension at least equal to a distance between the first and second conductive trace pads, said standoff at least partially conductive between said first and second trace pad, said at least one surface comprising a conductive overlay extending between the first and second trace pads.
Dependencies are inferred from the claim text.