Combination electrical power distribution and heat dissipating device
AssigneeVisteon Global Technologies, Inc.
InventorDavid Alan Parker
Life of this patent
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Abstract
In accordance with the teachings of the present invention, the electronic system comprises a housing having a base and a lid. A circuit board is installed on the base of the housing. At least one solder pad is disposed on the circuit board for receiving an electronic component. The solder pad provides both an electrical connection and a mechanical support to the electronic component. The electronic system is also provided with a devise that is capable of distributing power to the electronic component and simultaneously removing heat away from the electronic component. The device is also mounted on the solder pad and positioned adjacent to the electronic component.
Claims24
An electronic system for processing an electrical signal, the system comprising:
- a housing having a base and a lid;
- a circuit board installed on the base of the housing;
- at least one solder pad disposed on the circuit board;
- at least one electronic component mounted on the at least one solder pad;
- a device in contact with the at least one solder pad and positioned adjacent the at least one electronic component, the device distributes electrical power to the at least one electronic component and dissipates heat generated by the at least one electronic component, wherein the device comprises a first surface and a second surface;
- and
- at least one finger extending vertically from the first surface of the device towards the at least one solder pad.
A device for distributing power and dissipating heat in an electronic system, wherein the electronic system has a circuit board, a solder pad disposed on the circuit board and at least one electronic component mounted on the solder pad, the device comprising:
- a first surface parallel to the solder pad and the at least one electronic component, wherein the first surface is in communication with the solder pad and positioned adjacent to the at least one electronic component;
- a second surface opposite the first surface;
- and
- at least one finger extending vertically from the first surface towards the solder pad, wherein the device distributes electricity to the at least one electronic component and simultaneously receives heat from the at least one electronic equipment.
A method of distributing power and dissipating heat in an electronic system, the method comprising:
- providing a housing having a base and a lid;
- installing a circuit board on the base of the housing;
- disposing at least one solder pad on the circuit board;
- mounting at least one electronic component on the at least one solder pad;
- attaching a device to the at least one solder pad;
- positioning the device adjacent the at least one electronic component;
- wherein the device defines a first surface and a second surface opposite first surface;
- extending at least one finger vertically from the first surface;
- defining at least one through hole in the at least one solder pads;
- filling the at least one through hole with a soldering material;
- inserting the at least one finger into the at least one through hole;
- and
- soldering the at least one finger to the at least one solder pad to establish a electric and a thermal path to the at least one electronic component.
Dependencies are inferred from the claim text.