Method and apparatus for establishing quick and reliable connection between a semiconductor device handler plate and a semiconductor device test head plate

A method for positioning a semiconductor device handler plate with respect to a semiconductor device test head plate for the purpose of docking and undocking said handler plate with said test head plate, comprising:

• providing a handler plate having a dimension of length in an X-direction in addition having a dimension of width in an Y direction whereby said Y directional intersects said X direction under a right angle further having a dimension of height in an Z direction whereby said Z direction intersects a plane comprising said X and said Y direction under a right angle;
• providing roller assemblies that are attached to said handler plate;
• providing an assemblage of first electrical contacts that is attached to said handler base plate for purposes of semiconductor device testing;
• providing a test head plate having a dimension of length in an X-direction in addition having a dimension of width in an Y direction, whereby said Y direction intersects said X direction under a right angle, further having a dimension of height in an Z direction, whereby said Z direction intersects a plane comprising said X and said Y direction under a right angle, whereby said test head X-direction and Y-direction and Z-direction coincide respectively with said handler plate X-direction and Y-direction and Z-direction;
• providing receiver block assemblies attached to said test heat plate, said receiver block assemblies having a top surface having a top surface receiver assembly profile, whereby said receiver block assemblies are attached to said test head plate, whereby said receiver block assemblies comprise a receiver block having a top surface having a receiver block top surface profile, further having a cavity, whereby a sliding block having a groove provided in a surface, further having a pin line extrusion provided on a surface, further having a top surface having a sliding block top surface profile, whereby said sliding block is attached to said receiver block, whereby said receiver block and said sliding block each having a dimension of length in an X-direction in addition to having a dimension of width in an Y direction, whereby said Y direction intersects said X direction under a right angle, further having a dimension of height in an Z direction, whereby said Z direction intersects a plane comprising said X and said Y direction under a right angle, whereby said receiver block and said sliding block X-direction and Y-direction and Z-direction coincide respectively with said handler plate X-direction and Y-direction and Z-direction;
• providing an assemblage of second electrical contacts attached to said test head plate for purposes of semiconductor device testing;
• visually positioning and aligning said roller assemblies with said receiver block assemblies;
• partially entering said roller assemblies into said cavity provided in said receiver blocks;
• and
• engaging a pivot linkage assembly, said pivot linkage assembly being attached to said test head plate, said pivot linkage assembly forming a mechanical linkage between said receiver block assemblies, thereby docking and locking said handler plate with respect to said test head plate while at the same time establishing electrical contact between said assemblage of first electrical contacts and said assemblage of second electrical contacts for purposes of semiconductor device testing.