Flip chip die
AssigneeVIA Technologies, Inc.
InventorWen-Yuan Chang
Life of this patent
Estimating the term…
Abstract
A flip chip die, having a chip with an active surface, a passivation layer, at least one first bump pad and at least one second bump pad. The passivation layer, the first and second bump pads are formed on the active surface, where the first and second bump pads are exposed. The flip chip further has at least one first under ball metallurgy and one second under ball metallurgy formed on the first and the second bump pads, respectively. The contact area between the second under ball metallurgy and the second bump pad is larger than that between the first under ball metallurgy and the first bump pad. In addition, the flip chip has at least one first bump and at least one second bump formed on the first and second under ball metallurgies, respectively.
Claims5
A flip chip die, comprising:
- a die, having an active surface, on which a passivation layer, at least one first bump pad and at least one second bump pad are formed, where the first and second bump pads are exposed;
- at least one first under ball metallurgy formed on the first bump pad;
- at least one second under ball metallurgy formed on the second bump pad, wherein a contact area between the second bump pad and the second under ball metallurgy is larger than that between the first bump pad and the first under ball metallurgy;
- at least one first bump formed on the first under ball metallurgy, wherein the first bump is a signal bump;
- and
- at least one second bump formed on the second under ball metallurgy, wherein the second bump is a non-signal bump.
Dependencies are inferred from the claim text.