Integrated circuit device with covalently bonded connection structure
AssigneeIntel Corporation
InventorsTerry Sterrett, Tim Chen
Life of this patent
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Abstract
A method and apparatus provides increased operative life for flip-chip devices that are produced from an integrated circuit formed with electrically conductive bumps bonded to a printed circuit board substrate. The bumps and the substrate are formed from similar materials that allow control of the degree of latency for each element and produce a covalently bonded laminate structure when the bumps and substrate are brought together. The covalently bonded structure decreases bump fatigue to lengthen the operative life of the flip-chip device.
Claims19
An integrated circuit device, comprising:
- a die having a plurality of contacts;
- a substrate having a plurality of contact pads;
- a plurality of bumps formed on one of said contacts and contact pads;
- a plurality of pockets formed on other of said contacts and contact pads;
- and
- the bumps and pockets forming a covalently bonded structure.
An integrated circuit device, comprising:
- a die including a plurality of bumps initially formed from partially-cured electrically conductive polymer materials;
- a substrate including a plurality of contact pads, and a film, initially formed from partially-cured electrically non-conductive materials, surrounding each contact pad such as to expose the contact pads;
- and
- the bumps and non-conductive film forming a covalently bonded laminate structure.
An integrated circuit device, comprising:
- a substrate including a plurality of partially-cured electrically conductive polymer bumps;
- a die including a plurality of contact pads, and partially-cured electrically non-conductive film surrounding each contact pad such as to expose the contact pads;
- and
- the bumps and non-conductive film forming a covalently bonded laminate structure.
An integrated circuit device, comprising:
- a die including a contact pad surrounded by a collar, the collar being initially formed from partially-cured, non-electrically conductive materials, and a bump being formed that extends out of the collar;
- a substrate including a plurality of contact pads, and a film, initially formed from partially-cured electrically non-conductive materials, surrounding each contact pad such as to expose the contact pads;
- and
- the collar and non-conductive film forming a covalently bonded laminate structure.
An integrated circuit device, comprising:
- a die including a contact pad and a bump, initially formed from partially-cured electrically conductive or partially-cured non-conductive polymer materials, separated from the contact pad;
- a substrate including a plurality of contact pads, and a film, initially formed from partially-cured electrically non-conductive materials, surrounding each contact pad such as to expose the contact pads;
- and
- the bumps and non-conductive film forming a covalently bonded laminate structure.
An integrated circuit device, comprising:
- a die including a plurality of bumps initially formed, each using a single layer, from partially-cured electrically conductive polymer materials;
- a substrate including a plurality of contact pads, and a film, initially formed from partially-cured electrically non-conductive materials, surrounding each contact pad such as to expose the contact pads;
- and
- the bumps and non-conductive film forming a covalently bonded laminate structure.
An integrated circuit device, comprising:
- a die including a plurality of bumps and a layer surrounding each bump wherein the bumps and the layer being initially formed from partially-cured electrically conductive polymer materials;
- a substrate including a plurality of contact pads, and a film, initially formed from partially-cured electrically non-conductive materials, surrounding each contact pad such as to expose the contact pads;
- and
- the bumps, layer, and non-conductive film forming a covalently bonded laminate structure.
Dependencies are inferred from the claim text.