Die-up tape ball grid array package

An integrated circuit package comprising:

• a flexible circuit tape having a flexible polyimide tape laminated to a conductor layer, a plurality of blind holes extending through said flexible tape to said conductor layer and a plurality of through holes extending through said flexible tape and said conductor layer;
• a copper leadframe fixed to said flexible circuit tape and electrically isolated from said conductor layer, said copper leadframe including an etched down die attach pad and heat spreader portions, said die attach pad being etched down such that at least a portion of said die attach pad is reduced in thickness, said through holes in said flexible circuit tape extending through to said copper leadframe;
• a semiconductor die mounted on said at least a portion of said die attach pad;
• wire bonds from pads on said semiconductor die to said die attach pad and from other pads on said semiconductor die to said conductor layer;
• an encapsulating material encapsulating said semiconductor die and said wire bonds;
• a plurality of solder ball contacts in said through holes, fixed to said copper leadframe;
• and
• a plurality of solder ball contacts in said blind holes, fixed to said conductor.

A method of manufacturing an integrated circuit package comprising:

• providing a flexible circuit tape having a flexible polyimide tape laminated to a conductor layer, a plurality of blind holes extending through said flexible tape to said conductor layer and a plurality of through holes extending through said flexible tape and said conductor layer;
• fixing a copper leadframe to said flexible circuit tape and electrically isolating said copper leadframe from said conductor layer, said copper leadframe including an etched down die attach pad and heat spreader portions, said die attach pad being etched down such that at least a portion of said die attach pad is reduced in thickness, said through holes in said flexible circuit tape extending through to said copper leadframe;
• mounting a semiconductor die on said at least a portion of said die attach pad;
• wire bonding from pads on said semiconductor die to said die attach pad and from other pads on said semiconductor die to said conductor layer;
• encapsulating said semiconductor die and said wire bonds;
• fixing a plurality of solder ball contacts in said through holes, to said copper leadframe;
• and
• fixing a plurality of solder ball contacts in said blind holes, to said conductor.