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US 6,586,832 B2Granted
Semiconductor device and fabrication process thereof
AssigneeRohm Co., Ltd.
InventorsKazutaka Shibata, Junji Oka, Yasumasa Kasuya
Life of this patent
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Abstract
A semiconductor device which includes: a semiconductor chip bonded to a surface of a solid device; and a stiffener surrounding the periphery of the semiconductor chip. A surface of the stiffener opposite from the solid device is generally flush with a surface of the semiconductor chip opposite from the solid device.
Claims6
A semiconductor device comprising:
- semiconductor chip bonded to a surface of a solid device;
- and
- stiffener surrounding the periphery of the semiconductor chip with a surface thereof opposite from the solid device being generally flush with a surface of the semiconductor chip opposite from the solid device, the stiffener having a cross section with a width wider at a bottom along a solid device side than at a top of the stiffener.
A semiconductor device comprising:
- a semiconductor chip bonded to a surface of a solid device;
- and
- a stiffener surrounding the periphery of the semiconductor chip with a surface thereof opposite from the solid device being generally flush with a surface of the semiconductor chip opposite from the solid device, wherein the surface of the semiconductor chip opposite from the solid device and the surface of the stiffener opposite from the solid device are mirror-finished surfaces.
Dependencies are inferred from the claim text.