Ball grid array package
AssigneeSI Diamond Technology, Inc.
InventorsZvi Yaniv, Daniel Bruce Bullock, Curtis Nathan Potter
Life of this patent
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Abstract
The present invention provides a glass BGA (ball grid array) including a glass substrate having a plurality of conductive leads, such as thin film metal deposited thereon. A die or chip is mounted in a fixed relationship to the glass substrate, and is often mounted on the glass substrate. The die includes a plurality of I/O pads for providing electrical access to circuitry inside the die. Circuitry is included for connecting the plurality of I/O pads to the plurality of conductive leads on the glass substrate.
Claims16
An apparatus comprising:
- a glass substrate having a plurality of conductive leads deposited thereon;
- a die mounted on the glass substrate, the die having a plurality of input/output (“I/O”) pads for providing electrical access to circuitry inside the die;
- and
- circuitry for connecting the plurality of I/O pads to the plurality of conductive leads on the glass substrate, wherein the connecting circuitry further comprises a plurality of conductive bumps deposited on first ends of the conductive leads, wherein the conductive bumps physically contact the I/O pads on the die, wherein the conductive bumps are compliant bumps.
An apparatus comprising:
- a glass substrate having a plurality of conductive leads deposited thereon;
- a die mounted on the glass substrate, the die having a plurality of input/output (“I/O”) pads for providing electrical access to circuitry inside the die;
- circuitry for connecting the plurality of I/O pads to the plurality of conductive leads on the glass substrate further comprising a heat sink attached to the die by a thermally conductive adhesive;
- and
- wherein in the die is mounted to a recess in the heat sink.
An apparatus comprising:
- a glass substrate having a plurality of conductive leads deposited thereon;
- a die mounted in fixed relationship to the glass substrate, the die having a plurality of input/output (“I/O”) pads for providing electrical access to circuitry inside the die;
- and
- circuitry for connecting the plurality of I/O pads to the plurality of conductive leads on the glass substrate, wherein the glass substrate includes a plurality of holes formed therethrough and a conducting material deposited in each of the plurality of holes to form ball contacts on an underside of the glass substrate, wherein the conducting material is connected to the plurality of conductive leads.
An apparatus comprising:
- a glass substrate having a plurality of conductive leads deposited thereon;
- a die mounted in fixed relationship to the glass substrate, the die having a plurality of input/output (“I/O”) pads for providing electrical access to circuitry inside the die;
- and
- circuitry for connecting the plurality of I/O pads to the plurality of conductive leads on the glass substrate, wherein the conductive leads wrap around to an underside of the glass substrate and terminate in ball contacts adaptable for coupling to conductive traces on a PCB.
A glass substrate;
- a chip die mounted on the glass substrate with an adhesive underfill therebetween, wherein the I/O pads on the chip die physically contact electrical traces deposited on the glass substrate;
- a first heat sink mounted to the chip die with a thermal adhesive, wherein the first heat sink is also attached to the glass substrate with another adhesive;
- a printed circuit board having a second heat sink, wherein the second heat sink is connected to the first heat sink using an adhesive;
- and
- solder connections for interconnecting the electrical traces on the glass substrate to electrical traces on the printed circuit board.
Dependencies are inferred from the claim text.