Semiconductor device that can have a defective bit found during or after packaging process repaired

A semiconductor device comprising:

• a package;
• a hold member provided in said package;
• a plurality of memory chips held at said hold member, each said memory chip including
• a plurality of proper memory cells,
• a spare memory cell,
• a first storage circuit to store address information corresponding to a defective memory cell found during a fabrication process of said memory chip,
• an information replacement circuit that can alter said address information output from said first storage circuit according to externally applied additional replacement information,
• a replacement information input circuit to receive said additional replacement information from outside said memory chip, and
• a select circuit selecting any of said proper memory cell and said spare memory cell according to an output from said information replacement circuit and an address signal;
• a coupling member to transfer a signal between said plurality of memory chips;
• a replacement information storage circuit provided on set hold member to store said additional replacement information determined according to testing carried out on said plurality of memory chips after at least said plurality of memory chips and said coupling member are formed on said hold member;
• and
• a replacement storage control circuit provided on said hold member to apply said additional replacement information stored in said replacement information storage circuit to said replacement information input circuit of said plurality of memory chips.