Substrate for an electronic power circuit, and an electronic power module using such a substrate
AssigneeAlstom
InventorsBenoît Boursat, Emmanuel Dutarde, Nathalie Martin, Pierre Solomalala, José Saiz
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Abstract
An electronic power circuit substrate including a wafer of electrically insulating material, wherein said wafer presents a face supporting one or more conductive tracks directly connected to one or more electronic power components, said conductive tracks being obtained by fine metallization of said face to a thickness that is less than 150 μm.
Claims20
An electronic power circuit substrate including a wafer of electrically insulating material, wherein said wafer includes a face supporting one or more conductive tracks directly connected to one or more electronic power components, said conductive tracks being obtained by fine metallization of said face, said conductive tracks having a thickness that is less than 150 μm.
An electronic power circuit substrate comprising:
- a wafer of electrically insulating material with a face;
- a conductive track provided on said face, said conductive track directly connected to an electronic power component, said conductive track having a thickness that is less than 150 μm.
An electronic power circuit substrate comprising:
- a wafer of electrically insulating material, said wafer including a nickel-plated face;
- a conductive track provided on said nickel-plated face, said conductive track directly connected to an electronic power component.
Dependencies are inferred from the claim text.