Top-emitting and top-illuminated optoelectronic integrated circuit device
AssigneeHoneywell International Inc.
InventorYue Liu
Life of this patent
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Abstract
An opto-electronic integrated circuit device includes top emitter/detector devices on a substrate. The top emitter/detector devices have top and bottom sides. The top emitter/detector devices are capable of emitting and detecting light beam from the top side, and have top contact pads on the top side. An optically transparent superstrate is attached to the top side. Micro-optic devices such as lenses can be attached to the superstrate. Top contact pads are connected to bottom contact pads. The bottom contact pads are attached to matching pads of an integrated circuit chip to produce an opto-electronic integrated circuit.
Claims23
An opto-electronic device, comprising:
- a substrate;
- top emitter/detector devices, wherein the top emitter/detector devices are disposed on to the substrate, wherein the top emitter/detector devices emit and detect light from a top side, and wherein the substrate has a bottom side disposed across from the top side, wherein the top emitter/detector devices further have contact pads on the top side, wherein the bottom side includes bottom contact pads, wherein the bottom contact pads are connected to the top contact pads;
- and
- an optically transparent superstrate, attached to the top side of the top emitter/detector devices such that the optically transparent superstrate is disposed across from the bottom side, wherein the optically transparent superstrate has a top surface disposed across from the top side.
An opto-electronic integrated circuit device, comprising:
- a substrate;
- top emitter/detector devices, wherein the top emitter/detector devices are disposed on to the substrate, wherein the top emitter/detector devices have a top side to emit and detect light from the top side, and wherein the substrate has a bottom side disposed across from the top side, wherein the top emitter/detector devices further have top contact pads on the top side, wherein the bottom side includes bottom contact pads, wherein the bottom contact pads are connected to the top contact pads;
- an optically transparent superstrate, attached to the top side of the top emitter/detector devices such that the optically transparent superstrate is disposed across from the bottom side, wherein the optically transparent superstrate has a top surface disposed across from the top side;
- micro-optic devices, attached to the top surface of the optically transparent superstrate such that the micro-optic devices can provide optical processing to the top emitter/detector devices;
- and
- an electronic integrated circuit device, attached to the bottom side of the substrate such that the bottom contact pads are in contact with matching pads of the electronic integrated circuit device to produce an optoelectronic integrated circuit device having a high capacity optical I/O.
Dependencies are inferred from the claim text.