Micro-electro-discharge machining utilizing semiconductor electrodes

Abstract

Micro-electro-discharge machining is carried out utilizing a semiconductor array electrode having a substrate with a face surface and electrode protrusions extending from the face surface. The array electrode may be formed by lithographically patterning a semiconductor wafer such as a silicon wafer utilizing lithographic techniques of the type used in semiconductor device processing. The electrode protrusions in the surface of the substrate may be coated with a conducting metal. The electrode is positioned adjacent to a workpiece and a power supply is connected to the electrode and the workpiece to charge a capacitor until discharge takes place between the electrode protrusions and the surface of the workpiece, to electro-discharge-machine the workpiece to replicate the pattern of electrode protrusions into the workpiece. The semiconductor electrode is formed to be consumed during the machining process, during which many individual workpiece elements can be micromachined in parallel to provide rapid and economical production of micromachined parts.

Dependencies are inferred from the claim text.