Ceramic header assembly
AssigneeFinisar Corporation
InventorsPaul K. Rosenberg, Giorgio Giaretta, Stefano Schiaffino, Rudolf J. Hofmeister
Life of this patent
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Abstract
An improved transistor header assembly incorporating a rectangular platform perpendicularly bisecting the base of the transistor header. The ceramic platform provides the ability to house multiple electrical components and/or devices on either side of the base. The platform has a higher thermal conductivity than the base of a standard header. In addition, the platform increases the electrical input/output density of the header by increasing the number of potential electrical connections between the two sides of the base.
Claims31
A transistor header assembly for housing an electrical component comprising:
- a base formed from a metallic material, wherein the base has a device side and a component side;
- and
- a platform extending perpendicularly through both the device side and the component side of the base, wherein the platform further includes at least one conductive pathway extending substantially through the platform.
A transistor header assembly comprising:
- a base having a device side and a component side;
- means for housing an electrical component on a surface extending substantially perpendicular from both the device side and the component side of the base;
- and
- means for electrically connecting the device side of the base to the component side of the base.
A method for mounting an electrical component on a printed circuit board, comprising the acts of:
- providing a transistor header assembly including:
- a base formed from a metallic material, wherein the base has a device side and a component side;
- and
- a platform extending perpendicularly through both the device side and the component side of the base, wherein the platform further includes at least one conductive pathway extending substantially through the platform;
- providing an electrical component mounted on the device side of the platform, such that the electrical component is electrically connected to the at least one conductive pathway;
- and
- mounting the transistor header assembly to the printed circuit board.
Dependencies are inferred from the claim text.