Wafer processing apparatus and wafer processing method using the same

A wafer processing method, comprising the steps of:

• connecting a transfer chamber to a plurality of vacuum processing chambers via a plurality of gate valves, wherein the transfer chamber is exhaustible;
• connecting an oxygen atmosphere chamber to the transfer chamber via one of the plurality of gate valves;
• connecting a first gas feed line to the oxygen atmosphere chamber for feeding an oxygen-based gas into the oxygen atmosphere chamber;
• connecting a load lock chamber to the transfer chamber for facilitating the transfer of a wafer to and from the transfer chamber, wherein the load lock chamber is exhaustible;
• forming a predetermined layer on a wafer in one of the vacuum processing chambers;
• and
• oxidizing the predetermined layer on the wafer in the oxygen atmosphere chamber.

A wafer processing method comprising:

• connecting a plurality of vacuum processing chambers to a transfer chamber;
• connecting a load lock chamber to the transfer chamber, wherein the load lock chamber is exhaustible;
• connecting a first gas feed line for feeding an oxygen-based gas to the load lock chamber;
• forming a predetermined layer on a wafer in one of the plurality of vacuum processing chambers;
• and
• oxidizing the predetermined layer on the wafer in the load lock chamber.