Method and apparatus for endpoint detection during chemical mechanical polishing
AssigneeSpeedFam-IPEC Corporation
InventorPrabodh J. Parikh
Life of this patent
Estimating the term…
Abstract
An apparatus for in situ CMP endpoint detection is presented which includes a probe member for emitting and receiving light signals, a transparent plug mounted over the end of the probe, and a support member located about, and slidably engaged with, the outer circumference of the probe. In use, the plug is inserted into an opening in a polishing pad so that the top of the plug is recessed or coplanar with respect to the polishing surface of the pad and the support member is inserted into an opening in a platen such that a seal is formed between the platen and the support member. The probe member, plug, and/or support member may be disposable and replaceable either alone or in combination.
Claims15
An apparatus for endpoint detection during chemical mechanical polishing comprising:
- a probe member having an end for emitting and receiving light;
- a transparent plug mounted over the end of said probe member wherein said plug is inserted through an opening in a polishing pad for transmitting and receiving light therethrough during polishing;
- and
- a support member located beneath said plug and about a circumference of said probe member wherein said support member is positioned within, and forms a seal with, an opening in a platen.
An apparatus for endpoint detection during chemical mechanical polishing comprising:
- a probe member having an end for emitting and receiving light, and
- a transparent plug comprising a polymer that is chemically resistant to slurry mounted over the end of said probe member wherein said plug is inserted through an opening in a polishing pad for transmitting and receiving light therethrough during polishing.
An apparatus for endpoint detection during chemical mechanical polishing comprising:
- a probe member having an end for emitting and receiving light;
- a transparent plug mounted over the end of said probe member wherein said plug is inserted through an opening in a polishing pad for transmitting and receiving light therethrough during polishing;
- a support member located beneath said plug and about a circumference of said probe member wherein said support member is positioned within an opening in a platen;
- and
- a sealing mechanism for creating a seal between said support member and said platen.
A method for detecting endpoint detection during CMP comprising the steps of:
- selecting a probe member having an end for emitting and receiving light;
- mounting a transparent plug over the end of said probe;
- inserting said plug through an opening in a polishing pad;
- polishing a workpiece using said polishing pad;
- and
- transmitting and receiving an optical signal through said probe to determine an endpoint for polishing.
Dependencies are inferred from the claim text.