High performance RF inductors and transformers using bonding technique
AssigneeChartered Semiconductor Manufacturing Ltd.
InventorsKiat Seng Yeo, Hai Peng Tan, Jianguo Ma, Manh Anh Do, Kok Wai Johnny Chew
Life of this patent
Estimating the term…
Abstract
A method of fabricating an inductor using bonding techniques in the manufacture of integrated circuits is described. Bonding pads are provided over a semiconductor substrate. Input/output connections are made to at least two of the bonding pads. A plurality of wire bond loops are made between each two of the bonding pads wherein the plurality of wire bond loops forms the inductor.
Claims10
A method of fabricating an inductor in the fabrication of integrated circuits comprising:
- providing semiconductor device structures in and on a semiconductor substrate wherein said semiconductor device structures include topmost wedge bond wires;
- forming bonding pads overlying and contacting said topmost wedge bond wires;
- making input/output connections with two of said bonding pads;
- and
- forming a plurality of bond wire loops, each loop connecting each two of said bonding pads wherein said bond wire loops form said inductor wherein said inductor is a solenoid inductor.
A method of fabricating an inductor in the fabrication of integrated circuits comprising:
- providing semiconductor device structures in and on a semiconductor substrate wherein said semiconductor device structures include topmost wedge bond wires;
- forming bonding pads overlying and contacting said topmost wedge bond wires;
- making input/output connections with two of said bonding pads;
- and
- forming a plurality of bond wire loops, each loop connecting each two of said bonding pads wherein said bond wire loops form said inductor wherein said inductor is a spiral inductor.
A method of fabricating an inductor in the fabrication of integrated circuits comprising:
- providing semiconductor device structures in and on a semiconductor substrate wherein said semiconductor device structures include topmost wedge bond wires;
- forming bonding pads overlying and contacting said topmost wedge bond wires;
- making input/output connections with two of said bonding pads;
- and
- forming a plurality of bond wire loops, each loop connecting each two of said bonding pads wherein said bond wire loops form said inductor and wherein said inductor is selected from the group consisting of a solenoid inductor and a spiral inductor.
A method of fabricating an inductor in the fabrication of integrated circuits comprising:
- providing semiconductor device structures in and on a semiconductor substrate wherein said semiconductor device structures include topmost wedge wire bonds;
- forming bonding pads overlying and contacting said topmost wedge wire bonds;
- making input/output connections with two of said bonding pads;
- and
- forming a plurality of bond wire loops, each loop connecting each two of said bonding pads wherein said bond wire loops are selected from the group consisting of copper and gold, wherein said bond wire loops form said inductor, and wherein said inductor is a spiral inductor.
Dependencies are inferred from the claim text.