Method of manufacturing a semiconductor chip array with two-sided cooling

A method of manufacturing a semiconductor device comprising at least one die and a substrate, the substrate having at least one electrical connection region on a top surface of the substrate, the at least one die having a bottom surface supported by the top surface of the substrate separate from the at least one electrical connection region, the at least one die further comprising a top surface having a metal layer and a number of semiconductor elements below the metal layer, the method comprising the steps of:

• a) insulating portions that are exposed on and above the top surface of the substrate that are electrically connected to portions of the semiconductor elements other than upper die connections,
• b) enveloping the region above the top surface of the substrate to at least encompass the at least one die and the at least one electrical connection region of the substrate, a dam extending higher than the top surface of the at least one die,
• c) pouring a flowable, curable conductive material into the enveloped region above the top surface of the substrate, the conductive material covering the top surface of the at least one die, and
• d) curing the flowable conductive material,
• whereby an electrical connection is made between the at least one electrical connection region on the surface of the substrate and metal layer of the top surface of the at least one die.