US 6,586,276 B2 · Method for fabricating a microelectronic device using wafer-level adhesion layer deposition

Abstract

A passivation layer is formed over a semiconductor wafer carrying a plurality of independent circuits. The passivation layer includes openings to expose bond pads on the wafer. A conductive adhesion material is then deposited over the wafer and an optional protection layer is deposited over the conductive adhesion material. The wafer is then cut up into individual microelectronic dice. During a subsequent packaging process, one or more microelectronic dice are fixed within a package core to form a die/core assembly. Expanded bond pads are then formed over the die/core assembly. The adhesion material on each die enhances the adhesion between the expanded bond pads and the passivation material on the die. One or more metal layers are then built up over the die/core assembly to provide, for example, conductive communication between the terminals of the die and the external contacts/leads of the package.

Claims31

Dependent claims

A method for use in fabricating a microelectronic device, comprising:

providing a semiconductor wafer having a plurality of independent circuits formed thereon, said independent circuits each having bond pads on an upper surface of said semiconductor wafer;
forming a passivation layer over said upper surface of said semiconductor wafer, said passivation layer having openings in positions corresponding to bond pads on said upper surface of said semiconductor wafer;
depositing a conductive adhesion layer over said passivation layer;
cutting said semiconductor wafer into a plurality of individual circuit dice after said conductive adhesion layer has been deposited;
fixing a first die from said plurality of individual circuit dice within a package core to form a die/core assembly;
and
forming expanded bond pads over said die/core assembly in positions corresponding to openings in said passivation layer of said first die.

4 more elements

Dependencies are inferred from the claim text.

Method for fabricating a microelectronic device using wafer-level adhesion layer deposition

Life of this patent

Method for fabricating a microelectronic device using wafer-level adhesion layer deposition

Life of this patent

Abstract

Claims31