Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminal
AssigneeFujitsu Limited
InventorsYoshitaka Aiba, Mitsutaka Sato
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Abstract
A method of manufacturing a semiconductor device is provided. The method comprises a wire-forming step of forming a wiring on a substrate having an electrode pad so as to connect the electrode pad to a mounting terminal. The wire-forming step includes the steps of: applying a metal foil to the substrate by providing an adhesive therebetween; patterning the metal foil into a predetermined pattern so as to form the wiring; and connecting the wiring to the electrode pad electrically.
Claims8
A method of manufacturing a semiconductor device, the method comprising:
- a wire-forming step of forming a wiring on a substrate having an electrode pad so as to connect said electrode pad to a mounting terminal,
- wherein said wire-forming step includes the steps of:
- applying a metal foil to said substrate by providing an adhesive therebetween;
- patterning said metal foil into a predetermined pattern so as to form the wiring;
- and
- connecting said wiring to said electrode pad electrically,
- wherein said step of connecting is performed after said step of applying, and
- said step of applying includes removing a portion of said metal foil positioned above said electrode pad and a portion of said adhesive applied on said electrode pad by etching, and
- wherein a step of forming a barrier metal layer on said electrode pad is performed before said step of applying.
A method of manufacturing a semiconductor device, the method comprising:
- a wire-forming step of forming a wiring on a substrate having an electrode pad so as to connect said electrode pad to a mounting terminal,
- wherein said wire-forming step includes the steps of:
- applying a metal foil to said substrate by providing an adhesive therebetween;
- patterning said metal foil into a predetermined pattern so as to form the wiring;
- and
- connecting said wiring to said electrode pad electrically,
- wherein said step of connecting is performed after said step of applying,
- wherein said step of applying includes removing a portion of said metal foil positioned above said electrode pad and a portion of said adhesive applied on said electrode pad by a laser, and
- wherein a step of forming a barrier metal layer on said electrode pad is performed before said step of applying.
Dependencies are inferred from the claim text.