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US 6,586,105 B2Granted
Packaging structure and method for automotive components
AssigneeHitachi, Ltd.
InventorsShuji Eguchi, Masahiko Asano, Mutsumi Watanabe, Kunito Nakatsuru, Hiroatsu Tokuda
Life of this patent
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Abstract
The invention provides a packaging structure applied to an automotive component having semiconductors and electronic parts mounted on a ceramic base, characterized in that the semiconductors and electronic parts are partly or entirely sealed with a thixotropic silicone gel which has a thixotropy index of about 1.5-3.6 and a penetration depth of about 6-10 mm and a rate of change in viscosity of less than 10% of the initial value.
Claims14
A package structure comprising:
- a ceramic base having a top surface;
- an electronic component mounted on said top surface;
- a thixotropic silicone gel overlying said component;
- said component being connected by a conductive line to external terminal leads of a connector;
- and
- said gel having a thixotropy index of about 1.5-3.6, a penetration depth of about 6-10 mm, a viscosity of 1000-5000 mPa·s at 25° C., a light transmittance greater than 60%, an exothermic peak at 100-140° C., a one-pack form of uniform mixture, and a rate of change in viscosity of no more than 10% of the initial value after standing for 7 days at 40° C.
3 more elements
A package structure comprising:
- a ceramic base and a thixotropic silicone gel overlying said base,
- said gel having a thixotropy index of about 1.5-3.6, a penetration depth of about 6-10 mm and a rate of change in viscosity of no more than 10% of the initial value.
A method of fabricating a package structure comprising the steps of:
- providing a ceramic base having a top surface;
- mounting an electronic component on said top surface;
- providing a thixotropic silicone gel over said components;
- connecting said components by a conductive line to external terminal leads of a connector;
- said gel having a thixotropy index of about 1.5-3.6, a penetration depth of about 6-10 mm, and a rate of change in viscosity of no more than 10% of the initial value;
- and heat-hardening said gel.
3 more elements
Dependencies are inferred from the claim text.