Adhesive tape and substrate for adhesive tape
AssigneeNitto Denko Corporation
InventorsYoshio Nakagawa, Shigeki Ishiguro, Masayoshi Natsume, Shinichi Takada, Kooki Ooyama
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AssigneeNitto Denko Corporation
InventorsYoshio Nakagawa, Shigeki Ishiguro, Masayoshi Natsume, Shinichi Takada, Kooki Ooyama
Estimating the term…
The present invention provides an adhesive tape comprising a substrate and an adhesive layer formed on at least one side of the substrate, wherein the substrate comprises the following Component A, Component B and Component C: Component A: a thermoplastic resin having a carbonyl oxygen atom in the molecular skeleton Component B: a polymer alloy containing an ethylene component and a propylene component Component C: an inorganic metal compound surface-treated with a silane coupling agent but substantially no halogen atom. The adhesive tape and the substrate for the adhesive tape of the present invention are free of generation of dioxin or a toxic gas upon incineration, are superior in flexibility, resistance to thermal deformation, flame resistance and resistance to surface whitening, and show suitable stretchability and mechanical strength.
An adhesive tape comprising a substrate and an adhesive layer formed on at least one side of the substrate, wherein the substrate comprises the following Component A, Component B and Component C but substantially no halogen atom:
A substrate for an adhesive tape, which comprises the following Component A, Component B and Component C but substantially no halogen atom:
Dependencies are inferred from the claim text.