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US 6,586,047 B2Granted
Process for plating particulate matter
OwnerBrad Durkin, Boules H. Morcos +1inventors
InventorsBrad Durkin, Boules H. Morcos, Duncan Beckett
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Abstract
A process for electrolessly plating particulate matter is disclosed wherein the particulate and the electroless plating solution, without a reducing agent component, are combined with agitation in a plating vessel. If necessary, activator species are added directly to the plating solution. The reducing agent component is then added to the plating solution to initiate plating. Reliable plating upon the particulate, without instability of the plating solution, is achieved.
Claims9
A process for plating particulate matter, said process comprising:
- a). combining particulate matter and an electroless plating solution, without a reducing agent component, in a plating vessel with agitation;
- b). adding an activator for electroless plating to the plating solution;
- and then
- c). adding a reducing agent component to the plating solution;
- wherein the foregoing steps are carried out in the order given with respect to each other and wherein the electroless plating solution is selected from the group consisting of electroless nickel plating solutions, electroless copper plating solutions and combination thereof.
2 more elements
Dependencies are inferred from the claim text.