Leadless plastic chip carrier with partial etch die attach pad
AssigneeASAT Ltd.
InventorsChun Ho Fan, Tsui Yee Lin, Kin Yan Tsang, Neil McLellan
Life of this patent
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Abstract
A leadless plastic chip carrier comprising a die attach pad, a semiconductor die mounted to a portion of the die attach pad and at least one row of contact pads circumscribing the die attach pad. The row of contact pads have a thickness greater than the thickness of the portion of the die attach pad. A plurality of wire bonds connect the die attach pad and the contact pads. An overmold covers the semiconductor die and all except one surface of the at least one row of contact pads and the die attach pad.
Claims16
A leadless plastic chip carrier comprising:
- a die attach pad;
- a semiconductor die mounted to a portion of said die attach pad;
- at least one row of contact pads circumscribing said die attach pad, said at least one row of contact pads having a thickness greater than the thickness of said portion of said die attach pad;
- a plurality of wire bonds connecting said semiconductor die and said contact pads, and
- an overmold covering said semiconductor die and all except one surface of said at least one row of contact pads and said die attach pad.
A process for fabricating a leadless plastic chip carrier, comprising the steps of:
- depositing a photo-imageable etch resist on opposing first and second surfaces of a leadframe strip;
- imaging and developing said etch resist to define a pattern for a die attach pad and at least one row of contact pads;
- etching said leadframe strip to define said die attach pad and a plurality of said contact pads, such that a portion of said die attach pad has a thickness less than the thickness of said contact pads;
- mounting said semiconductor die to said portion of said die attach pad;
- wire bonding said semiconductor die to said contact pads;
- and
- encapsulating said first surface of said leadframe strip in a molding material.
Dependencies are inferred from the claim text.