Electrical circuit board and a method for making the same
AssigneeVisteon Global Tech., Inc.
InventorsRobert Edward Belke, Jr., Vivek A. Jairazbhoy, Thomas B. Krautheim, William F. Quitty, Jr.
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Abstract
A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26 which have improved solder-wetting characteristics by causing a first insulating layer to separate from a portion of a first conductive layer of the multi-layer electronic circuit board 10 which allows for communication by and between some or all of the various component containing surfaces, and portions of the formed multi-layer electrical circuit board 10, which selectively allows components contained within and/or upon these portions and surfaces to be interconnected.
Claims14
A method for forming a connection within a multi-layer circuit board a first and a second insulating layer and a first conductive layer which is disposed between said first and said second insulating layers, said method comprising the steps of:
- forming a first aperture through said first conductive layer, said first insulating layer and said second insulating layer in a manner effective to cause a portion of said first insulating layer to separate from a portion of said first conductive layer, thereby exposing said portion of said first conductive layer;
- and
- selectively inserting conductive material into said aperture effective to wet said portion of said first conductive layer, thereby metallurgically bonding a solder material to said first conductive layer.
A method for forming a solder connection within a multi-layer circuit board having a first and second conductive layer, and a first and a second insulating layer, said first conductive layer being disposed between said first and said second insulating layer, said second conductive layer having a first aperture, said method comprising the steps of:
- forming a second aperture through said first conductive layer, said first insulating layer and said second insulating layer such that said first aperture as a first side surface at least partially formed from aid first conductive layer and such that said first aperture has a perimeter which is disposed outside said second aperture;
- etching back at least a portion of said first side surface to form an at least partially recessed, surface between said first and second insulating layers;
- and
- wetting said recessed surface with a solder material, thereby metallurgically bonding said solder material to said first conductive layer.
Dependencies are inferred from the claim text.