Retaining ring with a three-layer structure
AssigneeApplied Materials, Inc.
InventorsSuzuki Kenji, Gen Yasuhara, Yoshihiro Sunada
Life of this patent
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Abstract
A wafer polishing apparatus 19 comprising a polishing head 3 having a retainer ring 20 provided around the periphery of a wafer W for suppressing movement of the wafer W in the radial direction during polishing. The retainer ring 20 comprises an attachment plate 21 affixed to the polishing head 3, a ceramic friction ring 22 brought into contact with a polishing pad 2, and a resin spacer 23 provided between the attachment plate 21 and the friction ring 22.
Claims13
A retainer ring for a polishing head of a wafer polishing apparatus, comprising
- an attachment plate to be affixed to the polishing head;
- a ceramic friction ring to be brought into contact with a polishing pad;
- and
- a resin spacer provided between the attachment plate and the friction ring.
A polishing head for chemical mechanical polishing, comprising:
- a wafer mounting surface;
- and
- a retainer ring provided around the periphery of a wafer on the wafer mounting surface for suppressing movement of said wafer in the radial direction during polishing, wherein the retainer ring includes an attachment plate to be affixed to the polishing head, a ceramic friction ring to be brought into contact with a polishing pad, and a resin spacer provided between the attachment plate and the friction ring.
A chemical mechanical polishing apparatus, comprising:
- a polishing surface;
- and
- polishing head to hold a wafer against the polishing surface, the polishing head including a wafer mounting surface and a retainer ring provided around the periphery of a wafer on the wafer mounting surface for suppressing movement of said wafer in the radial direction during polishing, wherein the retainer ring includes an attachment plate to be affixed to the polishing head, a ceramic friction ring to be brought into contact with the polishing pad, and a resin spacer provided between the attachment plate and the friction ring.
A retainer ring for a polishing head of a wafer polishing apparatus, comprising:
- an attachment plate to be affixed to the polishing head;
- a friction ring to be brought into contact with a polishing pad;
- and
- a spacer provided between the attachment plate and the friction ring,
- wherein the friction ring and the spacer are respectively formed into an annular shape and positioned adjacent to each other in an axial direction, and the spacer includes a covering portion formed on the inner circumferential portion of the spacer that extends along the axial direction in the direction of the friction ring and covers an inner circumferential surface of the friction ring.
Dependencies are inferred from the claim text.