Shielded microelectronic connector assembly and method of manufacturing

An electronics assembly, comprising:

• a first substrate having a plurality of electrically conductive terminals thereon;
• a plurality of connectors disposed in an array on said substrate, said connectors each having:
• a recess adapted to receive a modular plug having a plurality of first conductors disposed thereon;
• a plurality of second conductors adapted to conduct and electrical signal between said first conductors of said modular plug and said electrically conductive terminals of said substrate;
• and
• at least one electrical component disposed within the electrical pathway between said first conductors and said conductive terminals;
• and
• a second substrate disposed between said first substrate and said array of connectors;
• said second substrate being adapted to shield at least said second conductors and said at least one electronic components from external noise;
• wherein
• said second substrate comprises:
• a first layer, said first layer being substantially comprised of an electrically non-conductive material;
• a second layer disposed upon said first layer, said second layer comprising a metallic material adapted to mitigate transmission of electronic noise;
• and
• a plurality of apertures corresponding to respective ones of said second conductors;
• wherein the area of said substrate immediately surrounding said apertures does not have said second layer.

A connector assembly comprising:

• a plurality of individual connectors, each of said individual connectors having:
• means for receiving at least a portion of a modular plug, said modular plug having a plurality of first conducting means disposed thereon;
• second conducting means disposed at least partly within said means for receiving, said second conducting means being configured to form an electrical contact with respective ones of said first conducting means when said modular plug is received within said means for receiving, and form an electrical pathway between said first conducting means and an external device;
• and
• means for shielding being disposed proximate to said plurality of connectors, said shield having positioning means corresponding to respective ones of said second conducting means, said second conducting means being received in respective ones of said positioning means, said means for shielding further being configured to mitigate the transmission of electronic noise through said means for shielding during operation of at least one of said connectors;
• wherein said means for shielding comprises:
• a first layer, said first layer being substantially comprised of a metallic material;
• and
• a second layer disposed adjacent said first layer, said second layer comprising and electrically non-conductive material;
• wherein the area of said means for shielding immediately surrounding said positioning means does not have said first layer.

A method of manufacturing an electronic device comprising a plurality of electrical connectors formed in an array, comprising:

• forming a connector housing having an external surface and a plurality of individual connectors arranged in a first row and a second row, each of said connectors having a recess adapted to receive at least a portion of a modular plug;
• providing a first set of conductors having a first predetermined shape, said first shape including a first end and a second end;
• providing a second set of conductors having a second predetermined shape, said second shape including a first end and a second end;
• disposing said first end of said first set of conductors at least partially within said recess of each of said connectors in said first row;
• disposing said first end of said second set of conductors at least partially within said recess of each of said connectors in said second row;
• providing a non-conductive substrate;
• forming a plurality of apertures in said substrate;
• forming a layer of metallic material over at least a portion of said non-conducting substrate excluding at least some areas immediately surrounding said apertures;
• and
• positioning said substrate in proximity to said housing such that said second ends of said first and second sets of conductors are received within respective ones of said apertures.

A method of shielding an array of electrical connectors from electronic noise, said array having at least first and second rows of connectors and being mounted on an electronic device, at least a portion of said connectors having conductors and electronic signal conditioning elements associated therewith, comprising:

• providing a first noise shield having at least one non-conducting layer, a plurality of apertures formed in said at least one non-conducting layer, and an electrically conducting material disposed over said layer excluding at least some areas immediately surrounding said apertures;
• disposing said first noise shield between at least a portion of said connectors and said electronic device, the distal ends of said conductors passing through said apertures;
• providing a second noise shield;
• disposing said second noise shield around the external surfaces of said array;
• and
• terminating said array to said electronic device using said distal ends of said conductors;
• wherein said first and second noise shields cooperate to mitigate the transmission of noise through substantially all of said external surfaces of said array.

An electronic device comprising a plurality of electrical connectors formed in an array, produced using the method comprising:

• forming a connector housing having a plurality of individual connectors arranged in a first row and a second row, each of said connectors having a recess adapted to receive at least a portion of a modular plug having conductors disposed thereon;
• providing a first set of conductors for conducting electrical current, said first set of conductors having a first predetermined shape, said first shape including a first end and a second end;
• providing a second set of conductors for conducting electrical current, said second set of conductors having a second predetermined shape, said second shape including a first end and a second end;
• disposing said first end of said first set of conductors at least partially within said recess of each of said connectors in said first row so as to place said first end in position within said recess to contact the conductors of said modular plug when said plug is received within said recess;
• disposing said first end of said second set of conductors at least partially within said recess of each of said connectors in said second row so as to place said first end in position within said recess to contact the conductors of said modular plug when said plug is received within said recess;
• providing a substrate adapted for mitigating the transmission of electronic noise there across, said substrate comprising at least one non-conducting layer;
• forming a plurality of apertures in said substrate for receiving respective ones of said first and second sets of conductors;
• disposing a conductive material over at least a portion of said non-conducting layer excluding at least some areas immediately surrounding said apertures;
• and
• positioning said substrate in proximity to said housing such that said second ends of said first and second sets of conductors are received within respective ones of said apertures.

A connector assembly comprising:

• a connector housing comprising a plurality of connectors, each of said connectors having:
• a recess adapted to receive at least a portion of a modular plug, said modular plug having a plurality of first conductors disposed thereon;
• a plurality of second conductors disposed at least partly within said recess, said second conductors being configured to form an electrical contact with respective ones of said first conductors when said modular plug is received within said recess, and form an electrical pathway between said first conductors and an external device;
• and
• a substrate shield disposed proximate to said plurality of connectors and below said housing, said shield having a plurality of apertures corresponding to respective ones of said second conductors, said second conductors being received in respective ones of said apertures, said shield further being configured to mitigate the transmission of electronic noise through said shield during operation of at least one of said connectors;
• wherein said substrate shield comprises:
• a first layer, said first layer being substantially comprised of a non-conductive material;
• and
• a second layer disposed upon said first layer, said second layer comprising a metallic material;
• wherein the area of said substrate shield immediately surrounding said apertures does not have said second layer.

A connector assembly comprising:

• a connector housing comprising a plurality of connectors, each of said connectors having:
• a recess adapted to receive at least a portion of a modular plug, said modular plug having a plurality of first conductors disposed thereon;
• a plurality of second conductors disposed at least partly within said recess, said second conductors being configures to form an electrical contact with respective ones of said first conductors when said modular plug is received within said recess, and form an electrical pathway between said first conductors and an external device;
• an external noise shield;
• and
• a substrate shield independent of said external noise shield and disposed proximate to said plurality of connectors, said shield having a plurality of apertures corresponding to respective ones of said second conductors, said second conductors being received in respective ones of said apertures, said shield further being configured to mitigate the transmission of electronic noise through said shield during operation of at least one of said connectors;
• wherein said substrate shield comprises:
• a first layer, said first layer being substantially comprised of a non-conductive material;
• and
• a second layer disposed upon said first layer, said second layer comprising a metallic material;
• wherein the area of said substrate shield immediately surrounding said apertures does not have said second layer.