Memory modules having conductors at edges thereof and configured to conduct signals to or from the memory modules via the respective edges
AssigneeSamsung Electronics Co., Ltd.
InventorsTae-sung Jung, Won-ki Song
Life of this patent
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Abstract
Memory modules, and related memory module sockets, can include a plurality of connector pins adjacent to a first edge of the memory module that are configured to conduct a plurality of first signals to or from the memory module via the first edge and a plurality of first conductors adjacent to a second edge of the memory module that are configured to conduct a plurality of second signals to or from the memory module via the second edge.
Claims16
A memory module comprising:
- a plurality of connector pins adjacent to a first edge of the memory module configured to conduct a plurality of first signals to or from the memory module via the first edge;
- and
- a plurality of first conductors adjacent to a second edge of the memory module configured to conduct a plurality of second signals to another memory module that is substantially coplanar with the memory module via the second edge;
- wherein at least two of the plurality of first conductors are spaced apart from the second edge by different distances.
A memory module socket configured to be mounted on a system board and configured for insertion of first and second memory modules therein, the memory module socket comprising:
- a connector pin interface configured to electrically connect a plurality of first conductive lines on the system board to a plurality of first conductors located at a first edge of the first memory module when the first memory module is inserted in the memory module socket;
- and
- a first conductor interface configured to electrically connect a plurality of second conductors adjacent to a second edge of the first memory module to the second memory module that is substantially coplanar with the memory module when the first memory module is inserted in the memory module socket.
A memory module comprising:
- a circuit board;
- a plurality of memory devices on the circuit board;
- a plurality of pins electrically connected to the plurality of memory devices in a predetermined region of the circuit board;
- and
- a plurality of connector pins electrically connected to the plurality of memory devices on both sides of the region in which the memory devices are located on the circuit board, wherein the connector pins are disposed in multiple columns, wherein the connector pins are disposed in a zigzag pattern.
A memory module socket, configured to be mounted on a system board and configured for insertion of first and second memory modules therein, the memory module socket comprising:
- a connector pin interface configured to electrically connect a plurality of first conductive lines on the system board to a plurality of first conductors located at a first edge of the first memory module when the first memory module is inserted in the memory module socket;
- and
- a first conductor interface configured to electrically connect a plurality of second conductors adjacent to a second edge of the first memory module to the second memory module when the first memory module is inserted in the memory module socket.
Dependencies are inferred from the claim text.