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US 6,585,150 B1Granted
Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder
AssigneeInternational Business Machines Corporation
InventorsWilliam E. Bernier, Donald W. Henderson, James Spalik, Isabelle Paquin
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Abstract
A method for protecting tin oxide coated solder surfaces against further oxidation and a method for fluxless solder joining of such surfaces is provided.
Claims15
A method of protecting tin solderable surfaces comprising:
- providing a solderable surface having tin oxide thereon;
- providing a gas-phase ambient comprising a complexing agent;
- applying said complexing agent from said gas-phase to said solderable surface;
- forming a protected solderable surface by forming a reaction product with said tin oxide and said complexing agent, wherein said reaction product decomposes to a decomposition product selected from the group consisting of tin oxide and volatile products upon being exposed to reflow conditions;
- and
- storing said protected surface for later reflow.
3 more elements
Dependencies are inferred from the claim text.