Die bonder and/or wire bonder with a device for holding down a substrate
AssigneeESEC Trading SA
InventorsStefan Behler, Beat Zumbuehl, Reto Schubiger, Ruedi Grueter, Rolf Schuermann
Life of this patent
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Abstract
A Die Bonder or a Wire Bonder contains a device for holding down a substrate. The device comprises a table with drill holes. The drill holes are mechanically programmable with regard to whether vacuum can be applied to them or not. The mechanical programming enables a fast and easy adaptation of the device to different substrates.
Claims4
Die Bonder and/or Wire Bonder with a device for holding down a substrate comprising a table with drill holes to which vacuum can be applied, an under surface of the table having at least two cavities of different lengths to which vacuum can be applied, and a removable drawer, the surface of which faces the under surface of the table having cavities, whereby the cavities in the drawer comprise a lateral arm facing the cavities of the table and at least one lateral arm facing the drill holes, wherein the drawer can be engaged in different positions in the table whereby in the different positions of the drawer a different number of the cavities of the drawer and of the cavities of the table overlap.
Dependencies are inferred from the claim text.