System and method for package socket with embedded power and ground planes
AssigneeIntel Corporation
InventorsChee-Yee Chung, David Figueroa, Kris Frutschy, Bob Sankman, Farzaneh Yahyaei-Moayyed
Life of this patent
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Abstract
A system and method for embedding power and ground planes in a pin grid array (PGA) socket is provided. Integrated circuit pins are inserted into multiple insertion holes of varying dimensions in the power and ground planes. When the cover of the socket is slidably moved, power pins touch the power plane and ground pins touch the ground plane. Decoupling capacitors are also affixed to the substrate. Thus, the power delivery performance of the overall central processing unit (CPU) package is improved. Moreover, the power and ground planes enhance the mechanical strength of the socket which reduces warpage.
Claims9
A method of fabricating an integrated circuit socket, the method comprising:
- providing a base including a plurality of insertion holes;
- providing a cover including a plurality of insertion holes corresponding to the insertion holes in the base, the cover slidably attached to the base;
- embedding a plurality of power and ground planes in the socket, the power and ground planes fabricated from conductive metal mesh material;
- and
- affixing decoupling capacitors to the socket.
A method for fabricating a pin grid array (PGA) socket for affixing an integrated circuit to a motherboard, the method comprising:
- providing a base;
- providing a cover including a plurality of insertion holes corresponding to a plurality of insertion holes in the base, the cover slidably attached to the base;
- embedding a power and ground plane in the socket, the power and ground plane fabricated from conductive metal mesh material;
- inserting integrated circuit pins into a plurality of insertion holes of varying dimensions in the power and ground planes, the plurality of insertion holes in the power and ground planes corresponding to the insertion holes in the cover and the base;
- sliding the cover of the socket such that power pins touch the power plane and ground pins touch the ground plane;
- and
- affixing decoupling capacitors to the socket.
Dependencies are inferred from the claim text.