System and method to measure closed area defects
AssigneeAdvanced Micro Devices, Inc.
InventorsBharath Rangarajan, Bhanwar Singh, Khoi A. Phan, Ramkumar Subramanian
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Abstract
A system adapted to provide in-situ detection of closed area defects and a method for the same is provided. The system comprises a light source for directing light on to a wafer having a grating pattern etched thereon; a light detector for collecting the light reflected from the wafer; a processor operatively coupled to the light detector for converting the collected light into data associated with the grating pattern and determining the presence of the closed area defect; and a controller operatively coupled to the processor for determining whether the wafer requires additional processing to repair the closed area defect.
Claims29
A system adapted to provide in-situ detection of closed area defects, comprising:
- a light source for directing light on to a wafer having a grating pattern etched thereon;
- a light detector for collecting the light reflected from the wafer;
- a processor operatively coupled to the light detector for converting the collected light into data associated with the grating pattern and determining the presence of the closed area defect;
- and
- a controller operatively coupled to the processor for determining whether the wafer requires additional processing to repair the closed area defect.
A system adapted to provide in-situ detection and mitigation of closed area defects, comprising:
- one or more grating fabrication components for creating a grating pattern on a wafer;
- a light source for directing light on to the wafer having the grating pattern etched thereon;
- a light detector for collecting the light reflected from the wafer;
- a processor operatively coupled to the light detector for converting the collected light into data associated with the grating pattern and determining the presence of the closed area defect;
- and
- a controller operatively coupled to the processor for determining whether the wafer requires additional processing to repair the closed area defect and for communicating adjustments to the one or more grating fabrication components in order to mitigate subsequent occurrences of closed area defects.
A method for detection and reduction of closed area defects on a wafer comprising:
- directing a light at the wafer having a grating patterned etched thereon;
- collecting a light signature reflected from the wafer;
- detecting for the presence of the closed area defects on the wafer;
- and
- if the closed area defects are detected, then proceeding to additional processing to reduce the closed area defects.
A method for detection and reduction of closed area defects on a wafer comprising:
- patterning a grating onto the wafer using one or more grating fabrication components;
- directing a light at the wafer having the grating patterned etched thereon:
- collecting a light signature reflected from the wafer;
- detecting for the presence of the closed area defects on the wafer;
- if the closed area defects are detected, then performing additional processing to reduce the closed area defects;
- and
- if the closed area defects are detected, then communicating determined adjustments to the one or more grating fabrication components.
A system for detection and reduction of closed area defects on a wafer comprising:
- means for directing a light at the wafer having a grating patterned etched thereon;
- means for collecting a light signature reflected from the wafer;
- means for detecting for the presence of the closed area defects on the wafer;
- and
- means for performing additional processing on the wafer to address the detected closed area defect.
Dependencies are inferred from the claim text.