Exposure apparatus and fabrication method of semiconductor device using the same
AssigneeNikon Corporation
InventorTetsuo Takahashi
Life of this patent
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AssigneeNikon Corporation
InventorTetsuo Takahashi
Estimating the term…
Alignment is carried out between a mask and a wafer even during exposure as occasion demands, according to the movement of a pattern image caused by the positional fluctuation of a reflecting member. An exposure apparatus includes detection systems (13) and (14) for detecting the fluctuation amounts of reflecting members (M1) and (M2) from a reference position, and an arithmetic system (15) adapted to compute an amount of correction based on the detected fluctuation amounts, the amount of correction regarding at least one of the mask and the photosensitive substrate (4), and being necessary for substantial alignment between the pattern image formed in a moved state from a reference image-forming position and the photosensitive substrate (4). Based on the computed amount of correction, at least one of the mask and the photosensitive substrate is moved.
An exposure apparatus for transferring a pattern on a mask onto a photosensitive substrate, comprising:
An exposure method for transferring an image of a pattern formed on a mask onto a workpiece through a projection optical system, comprising:
An exposure apparatus for transferring a pattern on a mask onto a photosensitive substrate, comprising:
An exposure apparatus for transferring a pattern on a mask onto a photosensitive substrate, comprising:
An exposure apparatus for transferring a pattern on a mask onto a photosensitive substrate, comprising:
Dependencies are inferred from the claim text.