Method and structure for joining two substrates with a low melt solder joint
AssigneeInternational Business Machines Corporation
InventorMiguel A. Jimarez
Life of this patent
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Abstract
A method and structure to electrically and mechanically join a first a first electrically conductive pad on a first substrate to a second electrically conductive pad on a second substrate using a solder joint that includes a low-melt solder alloy composition. The second electrically conductive pad has a geometry that compels a gap size of a gap between the first substrate and the second substrate to exceed a distance between the first substrate and a surface of the second pad.
Claims19
An electrical structure, comprising:
- a first substrate, having a first electrically conductive pad thereon;
- second substrate, having a second electrically conductive pad thereon;
- and
- a solder joint that mechanically and electrically joins the first pad to the second pad, wherein the solder joint includes a low-melt alloy composition, wherein the solder joint is in direct mechanical contact with the first electrically conductive pad, wherein the solder joint is in direct mechanical contact with the second electrically conductive pad, and wherein the second pad has a geometry such that a gap size of a gap between the first substrate and the second substrate exceeds a distance between the first substrate and a surface of the second pad.
An electrical structure, comprising:
- a first substrate, having a first electrically conductive pad thereon;
- a second substrate, having a second electrically conductive pad thereon;
- and
- a solder joint that mechanically and electrically joins the first pad to the second pad, wherein the solder joint includes a low-melt alloy composition, wherein the second pad has a geometry such that a gap size of a gap between the first substrate and the second substrate exceeds a distance between the first substrate and a surface of the second pad, and wherein a portion of the second pad extends into the gap by an extension such that the gap size is about equal to the sum of the extension, a height of the solder joint, and a height of the first pad.
A method for forming an electronic structure, comprising:
- providing a first substrate, having a first electrically conductive pad thereon;
- providing a second substrate, having a second electrically conductive pad thereon;
- and
- forming a solder joint that mechanically and electrically joins the first pad to the second pad, wherein the solder joint includes a low-melt alloy composition, wherein the solder joint is in direct mechanical contact with the first electrically conductive pad, wherein the solder joint is in direct mechanical contact with the second electrically conductive pad, and wherein the second pad has a geometry such that a gap size of a gap between the first substrate and the second substrate exceeds a distance between the first substrate and a surface of the second pad.
Dependencies are inferred from the claim text.