Integrated circuit package with an IC chip and pads that dissipate heat away from the chip

An integrated circuit package comprising:

• a substrate having a fist surface and a second surface;
• a chip die mounted to the second surface of the substrate;
• plurality of pads carried by the chip die on a surface of the chip die that faces the second surface of the substrate, a first subset of the pads in electrical communication with circuitry in the chip die and a second subset of the pads in thermal communication with the chip die;
• a plurality of external interconnects carried by the substrate on the first surface of the substrate;
• a plurality of conductive traces coupled to the external interconnects and the first subset of the pads for carrying electrical signals between the external interconnects and the first subset of the pads;
• a plurality of thermal conductors thermally coupled to the second subset of the pads and the second surface of the substrate to carry heat from the second subset of the pads to the substrate;
• and
• a stiffening plate in thermal contact with the second surface of the substrate, the stiffening plate defining an opening in which the chip die is disposed.