Electrically isolated power device package
AssigneeIXYS Corporation
InventorKang Rim Choi
Life of this patent
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Abstract
A packaged power device includes a substrate including a first conductive layer, a second dielectric layer, and a third conductive layer. The first conductive layer is bonded to the second dielectric layer, and the second dielectric layer is bonded to the third conductive layer. The first and third conductive layers are electrically isolated from each other. The substrate has a lower surface. A semiconductor die is bonded to the first conductive layer of the substrate. A plastic package encloses the die and has a lower surface. A curved backside includes the lower surfaces of the plastic package and substrate.
Claims22
A packaged power device, comprising:
- a substrate including a first conductive layer, a second dielectric layer, and a third conductive layer, the first conductive layer being bonded to the second dielectric layer, and the second dielectric layer being bonded to the third conductive layer, the first and third conductive layers being electrically isolated from each other, the substrate having a lower surface;
- a semiconductor die being bonded to the first conductive layer of the substrate;
- a plastic package enclosing the die and having a lower surface;
- and
- a curved backside including the lower surfaces of the plastic package and substrate.
A power device, comprising:
- a direct bonded metal substrate having a first conductive layer, a second dielectric layer, and a third conductive layer;
- a semiconductor die bonded to the first conductive layer of the substrate;
- and
- a plastic package having a lower surface and substantially enclosing the die and exposing a lower surface of the second conductive layer, wherein a backside of the device has a curved surface.
Dependencies are inferred from the claim text.