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US 6,583,501 B2Granted
Lead frame for an integrated circuit chip (integrated circuit peripheral support)
AssigneeInstitute of Microelectronics
InventorsTai Chong Chai, Thiam Beng Lim, Yong Chua Teo, James Tan, Ray Camenforte, Eric Neo, Daniel Yap
Life of this patent
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Abstract
A lead-frame for connecting and supporting an integrated circuit chip with a chip accommodating zone with inwardly extending ears for supporting the chip including minimum shoulder area, and having open crack and delamination stopping regions.
Claims25
A lead frame for an integrated circuit chip having an outer marginal edge and an attach surface, said lead frame comprising:
- one or more sidebars,
- each of said one or more sidebars having an inner side and an outer side,
- each said inner side defining a boundary of a chip-accommodating zone,
- said zone being sized to accommodate the chip entirely therewithin in spaced relation with the outer marginal edge of the chip, and
- a plurality of ears connected to at least one of said inner sides and protruding into said chip-accommodating zone, each ear having a surface for engaging the attach surface of the chip in confronting relation along a portion of the outer marginal edge of the chip.
2 more elements
A lead-frame for connecting and supporting an integrated circuit chip, comprising:
- sidebars having inwardly extending ears for supporting the chip, and having open crack-stop areas therebetween.
An integrated circuit package comprising;
- a lead frame,
- an integrated circuit chip secured to the frame, said chip having an outer marginal edge and a frame-engaging surface,
- said frame comprising a plurality of sidebars, each having opposite ends, and having an inner side and an outer side, said sidebars defining a chip-accommodating zone, said zone being sized to accommodate the chip entirely within the inner sides of the sidebars in spaced relation therewith,
- a plurality of ears each being connected to an inner side and protruding into said chip-accommodating zone, each ear having a chip-supporting surface for engaging the frame engaging surface of the chip in confronting relationship therewith along a portion of the outer marginal edge defining a contact area with the frame engaging surface, said ears defining crack-stop areas between the ears and adjacent the sidebars;
- a chip attach material disposed between the ears and the chip in the contact area for securing the chip to the frame;
- an encapsulation material surrounding the chip and the frame and being bonded thereto.
3 more elements
Dependencies are inferred from the claim text.