Quad flat non-leaded package and leadframe for use in a quad flat non-leaded package

A quad flat non-leaded package arranged on a printed circuit board, the printed circuit board comprising a plurality of contact nodes and a ground contact node disposed at the center of the contact nodes, the quad flat non-leaded package comprising:

• a die pad having a first upper surface and a corresponding first lower surface, wherein a plurality of interlacing slots crossing each other are provided on the first lower surface, and wherein each of the interlacing slots uniformly extends from one edge of the first lower surface to another edge thereof to define a plurality of blocks;
• a plurality of leads disposed at the periphery of the die pad, each of the leads having respectively a second upper surface and a corresponding second lower surface;
• a chip having an active surface and a corresponding back surface, wherein the active surface is provided with a plurality of bonding pads respectively connected the leads, and the back surface of the chip is adhered onto the first upper surface of the die pad;
• and
• a molding compound encapsulating the chip, the second upper surface of the leads, the first upper surface of the die pad, and the interlacing slots while exposing the surface of the blocks and the second lower surface of the leads,
• wherein the second lower surface of each of the leads is respectively connected to the contact nodes of the printed circuit board through a plurality of first bonding materials, and the blocks are respectively connected to the ground contact nodes through a plurality of second bonding materials to provide electrical and heat conductive paths.