US 6,583,483 B2 · Semiconductor device and its manufacturing method

Abstract

In semiconductor device 10 under this invention, bonding pads 20 are lined up in a staggered pattern on the main surface of semiconductor chip 14 which is mounted on insulated substrate 12. Multiple stud bumps are stacked on top of the pads 20a which are located on the inner rows, and these stud bumps comprise stud bump stack 28. Conductive wire 22 connects the lands 18 on the insulated substrate with the corresponding bonding pads 20. The wire is formed with its beginning at the land and its end at the bonding pad. Via the stud bump stacks 28, the ends of conductive wire 22a on the inner pads are in a higher position than the ends of conductive wires 22b on the outer pads, so that the problem of neighboring conductive wires coming into contact does not occur.

Claims18

Dependent claims

A semiconductor device comprising:

a semiconductor chip comprising multiple bonding pads located in staggered rows on its edges;
a substrate mounted with the semiconductor chip and comprising multiple lands connected electrically to the above multiple bonding pads;
a bump portion formed on top of a bonding pad that is located on the inner side of the semiconductor chip;
a first conductive wire wherein the beginning is connected to a land and the end is connected to a bonding pad that is located on the outer side of the semiconductor chip;
a second conductive wire wherein the beginning is connected to a land and the end is connected to said bump on said bonding pad located on the inner side of the semiconductor chip;
and
resin affixing the semiconductor chip, said first conductive wire, and said second conductive wire.

4 more elements

Dependencies are inferred from the claim text.

Semiconductor device and its manufacturing method

Life of this patent

Semiconductor device and its manufacturing method

Life of this patent

Abstract

Claims18